An evaluation of DITAC QL thermoplastic ribbon adhesives for the attachment of large area die (10 mm Si chips) to ceramic based packages

A series of thermoplastic ribbon adhesives (DITAC QL) has been developed for the attachment of integrated circuits. The adhesives are reported to offer high throughput, high yields, and lower costs. They require no offline curing, have unlimited shelf life, can be reworked, and have low moisture contents. The authors describe the application of a range of DITAC QL materials (polyimide, aromatic polyester, and acrylic based) to the attachment of 10-mm*10-mm Si chips to Al/sub 2/O/sub 3/ substrates. The die bonds were inspected for voids and the performance of the bonds has been evaluated by thermal shock/temperature cycling and high-temperature shear tests. The results of the trials have demonstrated that the methods of application of heat and pressure to cause flow and adhesion of the materials is critical in reducing void content.<>