DocumentCode :
2696495
Title :
Three-dimensional integration of optical multi-chips using surface-activated bonding for high-density microsystems packaging
Author :
Higurashi, Eiji ; Chino, Daisuke ; Suga, Tadatomo ; Sawada, Renshi
Author_Institution :
Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo
fYear :
2008
fDate :
11-14 Aug. 2008
Firstpage :
62
Lastpage :
63
Abstract :
The hybrid integration of multiple chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this study, three-dimensional integration of optical chips was successfully performed using Au-Au surface-activated bonding (bonding temperature: 150degC). The fabricated microsystem consists of two elements: i) a micromachined silicon optical bench incorporating a bonded laser diode, micromirrors, and through-hole electrodes; and ii) a glass substrate incorporating bonded photodiodes, electrical interconnections, and refractive microlenses. The silicon optical bench and the glass substrate were vertically stacked by surface-activated bonding. The size of the fully integrated microsystem is only 2.6 mm times 2.6 mm times 1 mm thick. The design and fabrication process allow chip-scale and wafer-level packaging. In addition, application for laser Doppler velocimeter sensor is discussed.
Keywords :
Doppler measurement; chip scale packaging; integrated optoelectronics; laser velocimeters; micromechanical devices; semiconductor lasers; wafer level packaging; 3D integration; bonded laser diode; chip-scale packaging; electrical interconnections; high-density microsystems packaging; hybrid integration; laser Doppler velocimeter sensor; micromachined silicon; micromirrors; optical bench; optical multichips; optoelectronic microsystems; refractive microlenses; surface activated bonding; wafer-level packaging; Diode lasers; Glass; Integrated optics; Optical interconnections; Optical refraction; Optical sensors; Packaging; Silicon; Temperature; Wafer bonding; Compact packaging; Hybrid integration; Surface activated bonding; Three-dimensional integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical MEMs and Nanophotonics, 2008 IEEE/LEOS Internationall Conference on
Conference_Location :
Freiburg
Print_ISBN :
978-1-4244-1917-3
Electronic_ISBN :
978-1-4244-1918-0
Type :
conf
DOI :
10.1109/OMEMS.2008.4607829
Filename :
4607829
Link To Document :
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