• DocumentCode
    2696564
  • Title

    Towards printable robotics: Origami-inspired planar fabrication of three-dimensional mechanisms

  • Author

    Onal, Cagdas D. ; Wood, Robert J. ; Rus, Daniela

  • Author_Institution
    Comput. Sci. & Artificial Intell. Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2011
  • fDate
    9-13 May 2011
  • Firstpage
    4608
  • Lastpage
    4613
  • Abstract
    This work presents a technique which allows the application of 2-D fabrication methods to build 3-D robotic systems. The ability to print robots introduces a fast and low-cost fabrication method to modern, real-world robotic applications. To this end, we employ laser-engraved origami patterns to build a new class of robotic systems for mobility and manipulation. Origami is suitable for printable robotics as it uses only a flat sheet as the base structure for building complicated functional shapes, which can be utilized as robot bodies. An arbitrarily complex folding pattern can be used to yield an array of functionalities, in the form of actuated hinges or active spring elements. For actuation, we use compact NiTi coil actuators placed on the body to move parts of the structure on-demand. We demonstrate, as a proof-of-concept case study, the end-to-end fabrication and assembly of a simple mobile robot that can undergo worm-like peristaltic locomotion.
  • Keywords
    actuators; coils; hinges; mobile robots; nickel compounds; printing; 2D fabrication methods; 3D robotic systems; active spring elements; actuated hinges; arbitrarily complex folding pattern; coil actuators; laser-engraved origami patterns; low-cost fabrication method; mobile robot assembly; mobile robot end-to-end fabrication; origami-inspired planar fabrication; printable robotics; robot bodies; three-dimensional mechanisms; worm-like peristaltic locomotion; Actuators; Contracts; Fabrication; Materials; Robots; Shape; Springs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2011 IEEE International Conference on
  • Conference_Location
    Shanghai
  • ISSN
    1050-4729
  • Print_ISBN
    978-1-61284-386-5
  • Type

    conf

  • DOI
    10.1109/ICRA.2011.5980139
  • Filename
    5980139