Title :
Distributed sources of passive intermodulation on printed lines
Author :
Schuchinsky, Alexander G. ; Francey, Jim ; Fusco, Vincent F.
Author_Institution :
Queen´´s Univ., Belfast, UK
Abstract :
The sources of passive intermodulation (PIM) on matched uniform microstrip lines have been investigated. The results of PIM measurements and SEM analysis of the conductor traces fabricated on the PCB laminates coated by copper foils of different grades suggest that PIM sources on the printed transmission lines are of non-local nature being distributed along the signal path. Quality of the copper foil and roughness of its surface proved to critically affect PIM performance of the microstrip lines on the low loss PTFE based dielectric substrates.
Keywords :
copper; intermodulation; microstrip lines; printed circuit design; PCB laminates; PIM; SEM analysis; copper foils; distributed sources; low loss PTFE based dielectric substrates; matched uniform microstrip lines; nonlocal nature; passive intermodulation; printed lines; surface roughness; Conductors; Copper; Dielectric losses; Laminates; Microstrip; Performance loss; Rough surfaces; Signal analysis; Surface roughness; Transmission line measurements;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Print_ISBN :
0-7803-8883-6
DOI :
10.1109/APS.2005.1552847
