DocumentCode
2696594
Title
Distributed sources of passive intermodulation on printed lines
Author
Schuchinsky, Alexander G. ; Francey, Jim ; Fusco, Vincent F.
Author_Institution
Queen´´s Univ., Belfast, UK
fYear
2005
fDate
3-8 July 2005
Firstpage
447
Abstract
The sources of passive intermodulation (PIM) on matched uniform microstrip lines have been investigated. The results of PIM measurements and SEM analysis of the conductor traces fabricated on the PCB laminates coated by copper foils of different grades suggest that PIM sources on the printed transmission lines are of non-local nature being distributed along the signal path. Quality of the copper foil and roughness of its surface proved to critically affect PIM performance of the microstrip lines on the low loss PTFE based dielectric substrates.
Keywords
copper; intermodulation; microstrip lines; printed circuit design; PCB laminates; PIM; SEM analysis; copper foils; distributed sources; low loss PTFE based dielectric substrates; matched uniform microstrip lines; nonlocal nature; passive intermodulation; printed lines; surface roughness; Conductors; Copper; Dielectric losses; Laminates; Microstrip; Performance loss; Rough surfaces; Signal analysis; Surface roughness; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2005 IEEE
Print_ISBN
0-7803-8883-6
Type
conf
DOI
10.1109/APS.2005.1552847
Filename
1552847
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