DocumentCode
2696774
Title
Enhancing 2D phased array sensitivity and bandwidth using in-probe electronics
Author
Dziewierz, Jerzy ; Gachagan, Anthony
Author_Institution
Centre for Ultrasonic Eng., Univ. of Strathclyde, Glasgow, UK
fYear
2012
fDate
7-10 Oct. 2012
Firstpage
2400
Lastpage
2403
Abstract
An in-probe electronics printed circuit board (PCB) has been designed and built to improve the electrical matching issue in 2D ultrasonic array design. Each array channel has a dedicated line driver and the design utilized has low power consumption and importantly, a small footprint. Thus, the design is compatible with NDE probes, in which 128 elements are typical. The in-probe PCB was evaluated using a piezoceramic element scaled to obtain a 1kΩ impedance. Connected to the line driver, but otherwise acoustically un-matched, un-backed, the pulse-echo response from this element was acquired. Experimental results show an approximate 50dB improvement in sensitivity and an enhancement in bandwidth from 14.4% to 22.5% when compared to the ceramic interfaced directly to a standard 2m coaxial cable.
Keywords
driver circuits; piezoceramics; piezoelectric transducers; power consumption; printed circuits; ultrasonic transducer arrays; 2D ultrasonic array design; NDE probes; acoustically un-backed response; acoustically un-matched response; array channels; ceramic interface; dedicated line driver; electrical matching issue; enhanced 2D phased array sensitivity; in-probe PCB design; in-probe electronics printed circuit board; low power consumption; piezoceramic element; pulse-echo response; small footprint; standard 2m coaxial cable; Acoustics; Arrays; Bandwidth; Ceramics; Impedance; Probes; Sensitivity; Electronics; Ultrasonic Array;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location
Dresden
ISSN
1948-5719
Print_ISBN
978-1-4673-4561-3
Type
conf
DOI
10.1109/ULTSYM.2012.0600
Filename
6562524
Link To Document