DocumentCode
2696821
Title
Wafer level batch fabrication and assembly of small form factor optical pickup head
Author
Hsiao, Sheng-Yi ; Lee, Chih-Chun ; Chiu, Yi ; Shih, Hsi-Fu ; Chiou, Jin-Chern ; Shieh, Han-Ping D. ; Fang, Weileun
Author_Institution
Dept. Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu
fYear
2008
fDate
11-14 Aug. 2008
Firstpage
102
Lastpage
103
Abstract
A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.
Keywords
micro-optomechanical devices; mirrors; optical elements; optical fabrication; silicon; wafer level packaging; MEMS; crystalline-plane mirrors; laser diode; optical pickup head; silicon optical bench; small form factor; wafer level batch fabrication; Assembly; Crystallization; Diode lasers; Micromechanical devices; Mirrors; Optical device fabrication; Optical devices; Packaging; Silicon; Wafer scale integration; Small form factor; crystalline plane mirror; optical pickup head; wafer level packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMs and Nanophotonics, 2008 IEEE/LEOS Internationall Conference on
Conference_Location
Freiburg
Print_ISBN
978-1-4244-1917-3
Electronic_ISBN
978-1-4244-1918-0
Type
conf
DOI
10.1109/OMEMS.2008.4607849
Filename
4607849
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