DocumentCode :
2696862
Title :
A robust ultrafast switching methodology for device parameter characterization of bias-temperature instability
Author :
Hu, Y.Z. ; Ang, D.S. ; Teo, Z.Q. ; Du, G.A.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2010
fDate :
2-6 May 2010
Firstpage :
1058
Lastpage :
1062
Abstract :
A robust methodology for extracting MOSFET parameters (threshold voltage, Vt and effective mobility, μ̅eff) affected by the bias-temperature instability phenomenon is presented. The method is based on customary pulsed current-voltage measurement hardware and hence may be readily implemented using commercially available set-ups. Application of this method for Vt and μ̅eff extraction of a 1.8- nm thick SiON gate p-MOSFET under negative-bias temperature stress is demonstrated.
Keywords :
MOSFET; silicon compounds; MOSFET parameters extraction; SiON; SiON gate p-MOSFET; bias-temperature instability; bias-temperature instability phenomenon; device parameter characterization; negative-bias temperature stress; pulsed current-voltage measurement hardware; robust ultrafast switching methodology; size 1.8 nm; Degradation; Delay; Distortion measurement; MOSFET circuits; Particle measurements; Plasma temperature; Pulse measurements; Robustness; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-5430-3
Type :
conf
DOI :
10.1109/IRPS.2010.5488675
Filename :
5488675
Link To Document :
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