DocumentCode :
2697086
Title :
Disconnection of NiSi shared contact and its correction using NH3 soak treatment in Ti/TiN barrier metallization
Author :
Futase, Takuya ; Funayama, Kota ; Hashikawa, Naoto ; Tobimatsu, Hiroshi ; Yamamoto, Hirohiko ; Tanimoto, Hisanori
Author_Institution :
Wafer Process Manuf. Technol. Dept. 2, Renesas Electron. Corp., Hitachinaka, Japan
fYear :
2010
fDate :
2-6 May 2010
Firstpage :
995
Lastpage :
1000
Abstract :
During Ti/TiN barrier metallization of a shared contact in SRAM, an NH3 soak treatment selectively deoxidized silicon oxide on NiSi at the gate shoulder, improving the resistance of the contact. This deoxidizing NH3 soak treatment drastically reduced the drawbacks of conventional NH3 plasma treatment: plasma-induced damage of gate oxide and excessive nitridation of Ti/TiN. Although NH3 gas does not kinetically deoxidize silicon oxide, it does selectively deoxidize silicon oxide on the NiSi. We think that this is because the NiSi surface promotes the deoxidization of silicon oxide by NH3.
Keywords :
SRAM chips; integrated circuit metallisation; nickel compounds; titanium; titanium compounds; NiSi; SRAM; Ti-TiN; barrier metallization; contact resistance; gate shoulder; plasma treatment; plasma-induced damage; silicon oxide deoxidation; soak treatment; Logic devices; Metallization; Plasma applications; Plasma chemistry; Plasma devices; Plasma measurements; Random access memory; Silicon; Tin; Titanium; PECVD; SRAM; TiCl4; ammonia; barrier metal; contact; deoxidation; nickel silicide; plasma-induced damage; titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-5430-3
Type :
conf
DOI :
10.1109/IRPS.2010.5488688
Filename :
5488688
Link To Document :
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