DocumentCode
2697086
Title
Disconnection of NiSi shared contact and its correction using NH3 soak treatment in Ti/TiN barrier metallization
Author
Futase, Takuya ; Funayama, Kota ; Hashikawa, Naoto ; Tobimatsu, Hiroshi ; Yamamoto, Hirohiko ; Tanimoto, Hisanori
Author_Institution
Wafer Process Manuf. Technol. Dept. 2, Renesas Electron. Corp., Hitachinaka, Japan
fYear
2010
fDate
2-6 May 2010
Firstpage
995
Lastpage
1000
Abstract
During Ti/TiN barrier metallization of a shared contact in SRAM, an NH3 soak treatment selectively deoxidized silicon oxide on NiSi at the gate shoulder, improving the resistance of the contact. This deoxidizing NH3 soak treatment drastically reduced the drawbacks of conventional NH3 plasma treatment: plasma-induced damage of gate oxide and excessive nitridation of Ti/TiN. Although NH3 gas does not kinetically deoxidize silicon oxide, it does selectively deoxidize silicon oxide on the NiSi. We think that this is because the NiSi surface promotes the deoxidization of silicon oxide by NH3.
Keywords
SRAM chips; integrated circuit metallisation; nickel compounds; titanium; titanium compounds; NiSi; SRAM; Ti-TiN; barrier metallization; contact resistance; gate shoulder; plasma treatment; plasma-induced damage; silicon oxide deoxidation; soak treatment; Logic devices; Metallization; Plasma applications; Plasma chemistry; Plasma devices; Plasma measurements; Random access memory; Silicon; Tin; Titanium; PECVD; SRAM; TiCl4 ; ammonia; barrier metal; contact; deoxidation; nickel silicide; plasma-induced damage; titanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488688
Filename
5488688
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