• DocumentCode
    2697086
  • Title

    Disconnection of NiSi shared contact and its correction using NH3 soak treatment in Ti/TiN barrier metallization

  • Author

    Futase, Takuya ; Funayama, Kota ; Hashikawa, Naoto ; Tobimatsu, Hiroshi ; Yamamoto, Hirohiko ; Tanimoto, Hisanori

  • Author_Institution
    Wafer Process Manuf. Technol. Dept. 2, Renesas Electron. Corp., Hitachinaka, Japan
  • fYear
    2010
  • fDate
    2-6 May 2010
  • Firstpage
    995
  • Lastpage
    1000
  • Abstract
    During Ti/TiN barrier metallization of a shared contact in SRAM, an NH3 soak treatment selectively deoxidized silicon oxide on NiSi at the gate shoulder, improving the resistance of the contact. This deoxidizing NH3 soak treatment drastically reduced the drawbacks of conventional NH3 plasma treatment: plasma-induced damage of gate oxide and excessive nitridation of Ti/TiN. Although NH3 gas does not kinetically deoxidize silicon oxide, it does selectively deoxidize silicon oxide on the NiSi. We think that this is because the NiSi surface promotes the deoxidization of silicon oxide by NH3.
  • Keywords
    SRAM chips; integrated circuit metallisation; nickel compounds; titanium; titanium compounds; NiSi; SRAM; Ti-TiN; barrier metallization; contact resistance; gate shoulder; plasma treatment; plasma-induced damage; silicon oxide deoxidation; soak treatment; Logic devices; Metallization; Plasma applications; Plasma chemistry; Plasma devices; Plasma measurements; Random access memory; Silicon; Tin; Titanium; PECVD; SRAM; TiCl4; ammonia; barrier metal; contact; deoxidation; nickel silicide; plasma-induced damage; titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2010 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-5430-3
  • Type

    conf

  • DOI
    10.1109/IRPS.2010.5488688
  • Filename
    5488688