DocumentCode
2697207
Title
Ball Grid Array (BGA): The New Standard For High I/O Surface Mount Packages
Author
Freyman, Bruce ; Marrs, Robert
fYear
1993
fDate
9-11 Jun 1993
Firstpage
41
Lastpage
45
Keywords
Assembly; Copper; Electronic packaging thermal management; Electronics industry; Electronics packaging; Lead; Packaging machines; Plastic packaging; Soldering; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639328
Filename
639328
Link To Document