Title :
Ball Grid Array (BGA): The New Standard For High I/O Surface Mount Packages
Author :
Freyman, Bruce ; Marrs, Robert
Keywords :
Assembly; Copper; Electronic packaging thermal management; Electronics industry; Electronics packaging; Lead; Packaging machines; Plastic packaging; Soldering; Thermal resistance;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639328
