Practical considerations of process corner evaluation for deep-sub micron technology nodes using the example of its impact on electromigration

In this paper a practical approach of investigating reliability performance over a specific process window is described. Based on an example of electromigration robustness evaluation, we present the calculation methods which need to be applied to correctly take reliability performance variation into account. This method also provides the possibility to investigate extreme corner reliability even failing the overall requirements so that the complete process window can be budgeted to fulfill the reliability requirement on the process.