• DocumentCode
    2698321
  • Title

    On the bias dependence of time exponent in NBTI and CHC effects

  • Author

    Velamala, Jyothi B. ; Reddy, Vijay ; Zheng, Rui ; Krishnan, Srikanth ; Cao, Yu

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2010
  • fDate
    2-6 May 2010
  • Firstpage
    650
  • Lastpage
    654
  • Abstract
    NBTI and CHC are two leading reliability concerns. Their degradation rate, which is represented by the time exponent (n), varies with multiple factors, such as the measurement method and bias voltages (i.e., different n for sub-threshold or linear current). Such a variation significantly affects the long-term prediction of circuit lifetime. By investigating the underlying mechanisms and silicon data, we conclude that the bias dependence is due to intrinsic device non-linearity. With a unified aging model of threshold voltage (Vth) shift, different time exponents in different operation regions are consistently explained. The proposed solution captures the change of n under various supply voltages (Vdd), as validated with silicon data from transistors and RO measurement. It helps improve the accuracy in reliability prediction, reducing unnecessary design margins. Based on the result, the device and circuit lifetime is expected to be enhanced operating at lower Vdd due to the reduction in the time exponent.
  • Keywords
    integrated circuit design; integrated circuit reliability; integrated circuit testing; CHC; NBTI; RO measurement; bias voltages; channel hot carrier; circuit lifetime; negative bias temperature instability; reliability prediction; silicon data; supply voltages; threshold voltage shift; time exponent bias dependence; transistors; Accuracy; Aging; Circuits; Current measurement; Degradation; Niobium compounds; Silicon; Threshold voltage; Time measurement; Titanium compounds; CHC; NBTI; Temporal degradation; reaction-diffusion; time exponent;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2010 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-5430-3
  • Type

    conf

  • DOI
    10.1109/IRPS.2010.5488754
  • Filename
    5488754