DocumentCode
2698536
Title
Storage-work joint degradation model for discontinuous-working devices
Author
Jinglun Zhou ; Long Cheng ; Jing Feng ; Quan Sun
Author_Institution
Coll. of Inf. Syst. & Manage., Nat. Univ. of Defense Technol., Changsha, China
fYear
2012
fDate
15-18 June 2012
Firstpage
345
Lastpage
348
Abstract
For discontinuous-working devices, storage and work states may appear alternately. The health state of the device can be monitored by observing key performance parameters in engineering, which can be also taken as a basis to predict and analyze life and reliability of the device. For this kind of device, this paper comprehensively analyzes performance degradation mechanism in storage and working conditions, and establishes a storage-work joint model for the device, then estimates parameters of the joint degradation model by analyzing performance degradation data with change point characteristic. On this basis, reliability analysis and life prediction will be achieved. In the end of this paper, a joint degradation model of the metalized film capacitor will be established, and the reliability and life of the capacitor will also be calculated and predicted.
Keywords
capacitors; condition monitoring; parameter estimation; performance evaluation; reliability; remaining life assessment; change point characteristic; device health state monitoring; device reliability; discontinuous-working devices; key performance parameters; life prediction; metalized film capacitor; parameter estimation; performance degradation data analysis; performance degradation mechanism; reliability analysis; storage condition; storage-work joint degradation model; storage-work joint model; working condition; Capacitance; Capacitors; Degradation; Films; Joints; Performance evaluation; Reliability; discontinuous-working devices; joint degradation model; metalized film capacitor; random change points;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2012 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4673-0786-4
Type
conf
DOI
10.1109/ICQR2MSE.2012.6246251
Filename
6246251
Link To Document