Title :
Reliability evaluation methodology for chip-package interaction - die corner edge failure mechanism
Author :
Chin, Melida ; Marathe, Amit
Author_Institution :
GLOBALFOUNDRIES, Sunnyvale, CA, USA
Abstract :
A novel reliability qualification methodology to evaluate chip-package interaction (CPI) is presented. Experimental and finite element analysis results are combined in a new protocol that provides solutions to address the need of CPI test vehicles for pre-qualification purposes, more accurate CPI risk projection, and more flexibility for productization.
Keywords :
chip-on-board packaging; flip-chip devices; integrated circuit reliability; CPI risk projection; CPI test vehicles; chip-package interaction; finite element analysis; flip-chip devices; reliability evaluation methodology; Delamination; Environmentally friendly manufacturing techniques; Failure analysis; Finite element methods; Force measurement; Packaging; Protocols; Qualifications; Testing; Vehicles; CPI; crack driving force; crackstop; reliability;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-5430-3
DOI :
10.1109/IRPS.2010.5488789
