DocumentCode
2699276
Title
Interface control in double diffused polysilicon bipolar transistors
Author
Turner, J.E. ; Coen, D. ; Burton, G. ; Kapoor, A. ; Rosner, S.J. ; Johnson, W.
Author_Institution
Hewlett-Packard, Palo Alto, CA, USA
fYear
1990
fDate
17-18 Sep 1990
Firstpage
33
Lastpage
36
Abstract
The properties of the polysilicon/silicon interface which contribute to variations in DC performance of bipolar transistors are investigated. Measurements of interfacial oxide thickness and epitaxial realignment of the polysilicon are correlated with gain, emitter resistance, and poly sheet resistance from complete devices, two-mask bipolar structures, and unpatterned implanted poly subjected to base-emitter drive cycles. The data obtained suggest that significant benefits may be realized in the fabrication of diffused polysilicon bipolar transistors if rapid thermal processing is used for the emitter drive. Higher gain and potentially lower emitter resistance may be obtained if epitaxial realignment is initiated by minimizing the amount of interfacial oxide introduced prior to deposition
Keywords
bipolar transistors; elemental semiconductors; incoherent light annealing; semiconductor device testing; semiconductor technology; silicon; DC performance; Si; base-emitter drive cycles; double diffused polysilicon bipolar transistors; emitter resistance; epitaxial realignment; gain; interfacial oxide thickness; poly sheet resistance; polysilicon/silicon interface; rapid thermal processing; two-mask bipolar structures; Bipolar integrated circuits; Bipolar transistors; Electrical resistance measurement; Furnaces; Gain measurement; Integrated circuit technology; Oxygen; Rapid thermal annealing; Research and development; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar Circuits and Technology Meeting, 1990., Proceedings of the 1990
Conference_Location
Minneapolis, MN
Type
conf
DOI
10.1109/BIPOL.1990.171119
Filename
171119
Link To Document