Title :
Effect of multiple-transistor charge collection on SET pulse widths
Author :
Ahlbin, J.R. ; Gadlage, M.J. ; Atkinson, N.M. ; Bhuva, B.L. ; Witulski, A.F. ; Holman, W.T. ; Massengill, L.W. ; Eaton, P.H. ; Narasimham, B.
Author_Institution :
Dept. of Elec. Eng. & Comp. Sci., Vanderbilt Univ., Nashville, TN, USA
Abstract :
New heavy-ion data from a 130 nm bulk CMOS process shows a counterproductive result in using a common single-event charge collection mitigation technique. Guard bands can reduce single-event pulse widths for normal strikes, but increase them for angled strikes. Calibrated 3D TCAD mixed-mode modeling has identified a multiple-transistor charge collection mechanism that explains the experimental data, namely that angled strikes result in charge collection in the normally ON device that increases the restoring current on the struck device.
Keywords :
CMOS integrated circuits; MOSFET; radiation hardening (electronics); CMOS process; SET pulse widths; calibrated 3D TCAD mixed-mode modeling; guard bands; multiple-transistor charge collection effect; single-event charge collection mitigation technique; size 130 nm; struck device; CMOS process; CMOS technology; Error analysis; MOSFETs; Microelectronics; Pulse circuits; Pulse width modulation inverters; Space vector pulse width modulation; Transistors; Voltage; SER; SET; charge sharing; pulse width; radiation environment; single event; single event transient; soft error;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-5430-3
DOI :
10.1109/IRPS.2010.5488828