DocumentCode
2699748
Title
Reliability of SiC power devices and its influence on their commercialization - review, status, and remaining issues
Author
Treu, Michael ; Rupp, Roland ; Sölkner, Gerald
Author_Institution
Technol. Dev. SiC & High Voltage MOS Devices, Infineon Technol. Austria AG, Villach, Austria
fYear
2010
fDate
2-6 May 2010
Firstpage
156
Lastpage
161
Abstract
The following paper will give an overview about the main reliability aspects of silicon carbide power devices. After a brief review of the key device concepts it covers reliability topics of bipolar devices, Schottky diodes, metal oxide semiconductor field effect devices, and junction field effect devices. Special attention is paid to the influence of the different reliability topics on the commercialization of the different device types. It will be shown that for some device types the reliability is at a very high level being not hampering commercialization (e.g. Schottky diodes or junction field effect devices) whereas other devices concepts still need improvement until commercialization (e.g. bipolar devices).
Keywords
Schottky diodes; junction gate field effect transistors; power MOSFET; semiconductor device reliability; silicon compounds; wide band gap semiconductors; Schottky diodes; SiC; SiC power device reliability; bipolar devices reliability; junction field effect devices; metal oxide semiconductor field effect devices; Commercialization; Degradation; Epitaxial growth; Paper technology; Schottky diodes; Semiconductor diodes; Silicon carbide; Stacking; Switches; Voltage; MOS; Schottky diode; bipolar degradation; gate oxide integrity; packaging; silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488834
Filename
5488834
Link To Document