DocumentCode
2699939
Title
Mechanical properties of AlCu film alloys prepared by thermal diffusion
Author
Huerta, E. ; Oliva, A.I. ; Corona, J.E. ; González-Hernández, J.
Author_Institution
Dept. de Fis. Aplic., CINVESTAV-IPN Unidad- Merida, Mérida, Mexico
fYear
2011
fDate
26-28 Oct. 2011
Firstpage
1
Lastpage
6
Abstract
Mechanical properties of AlCu alloys deposited by thermal evaporation on Kapton substrates and formed by thermal diffusion were investigated. Formation of an Al2Cu phase was confirmed by XPS technique. Surface morphology was examined by AFM and SEM before and after tension mechanical testing. Stress-strain curves of the alloy film were obtained by subtracting the effect of the Kapton substrate from that of the film-Kapton system. Reduction of the elastic modulus and improved ductility of the AlCu alloys with increasing of thickness were found. A decrement in the surface rms-roughness and an increment of the grain size after tensile testing were found.
Keywords
X-ray photoelectron spectra; aluminium alloys; atomic force microscopy; copper alloys; ductility; elastic moduli; metallic thin films; scanning electron microscopy; stress-strain relations; surface morphology; surface roughness; tensile testing; thermal diffusion; vacuum deposition; AFM; AlCu; Kapton substrates; SEM; XPS; ductility; elastic modulus; film alloys; grain size; mechanical properties; stress-strain curves; surface morphology; surface rms-roughness; tensile testing; tension mechanical testing; thermal diffusion; Annealing; Copper; Films; Substrates; Surface morphology; Testing; AlCu alloy; mechanical properties; thermal diffusion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering Computing Science and Automatic Control (CCE), 2011 8th International Conference on
Conference_Location
Merida City
Print_ISBN
978-1-4577-1011-7
Type
conf
DOI
10.1109/ICEEE.2011.6106686
Filename
6106686
Link To Document