DocumentCode
2700139
Title
Two independent components modeling for Negative Bias Temperature Instability
Author
Huard, Vincent
Author_Institution
STMicroelectronics, Crolles, France
fYear
2010
fDate
2-6 May 2010
Firstpage
33
Lastpage
42
Abstract
Based on vast experimental dataset obtained from different technologies (pure or nitrided SiO2 and HK), we suggest that Negative Bias Temperature Instability is made of two independent components, presenting different voltage and temperature acceleration factors as well as process dependences. The recoverable part, subject to fast transient effects, is shown to obey field-assisted LRME hole trapping/detrapping processes. The permanent part is shown to be made of an equal number of interface traps and positive fixed charges, as resulting from hydrogen transfer to oxygen bridge. This hydrogen transfer was shown for the first time to be reversible allowing in-depth analysis of the microscopic mechanisms at play.
Keywords
MOSFET; hole traps; independent component analysis; interface states; semiconductor device reliability; transient analysis; fast transient effects; field-assisted LRME hole detrapping process; field-assisted LRME hole trapping process; hydrogen transfer; independent component modeling; interface traps; lattice-relaxation multiphonon emission process; microscopic mechanism in-depth analysis; negative bias temperature instability; oxygen bridge; pMOS transistor; positive fixed charges; temperature acceleration factors; voltage acceleration factors; Hydrogen; Microscopy; Negative bias temperature instability; Niobium compounds; Plasma temperature; Scalability; Thermal degradation; Thermal stresses; Titanium compounds; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488857
Filename
5488857
Link To Document