• DocumentCode
    2700139
  • Title

    Two independent components modeling for Negative Bias Temperature Instability

  • Author

    Huard, Vincent

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2010
  • fDate
    2-6 May 2010
  • Firstpage
    33
  • Lastpage
    42
  • Abstract
    Based on vast experimental dataset obtained from different technologies (pure or nitrided SiO2 and HK), we suggest that Negative Bias Temperature Instability is made of two independent components, presenting different voltage and temperature acceleration factors as well as process dependences. The recoverable part, subject to fast transient effects, is shown to obey field-assisted LRME hole trapping/detrapping processes. The permanent part is shown to be made of an equal number of interface traps and positive fixed charges, as resulting from hydrogen transfer to oxygen bridge. This hydrogen transfer was shown for the first time to be reversible allowing in-depth analysis of the microscopic mechanisms at play.
  • Keywords
    MOSFET; hole traps; independent component analysis; interface states; semiconductor device reliability; transient analysis; fast transient effects; field-assisted LRME hole detrapping process; field-assisted LRME hole trapping process; hydrogen transfer; independent component modeling; interface traps; lattice-relaxation multiphonon emission process; microscopic mechanism in-depth analysis; negative bias temperature instability; oxygen bridge; pMOS transistor; positive fixed charges; temperature acceleration factors; voltage acceleration factors; Hydrogen; Microscopy; Negative bias temperature instability; Niobium compounds; Plasma temperature; Scalability; Thermal degradation; Thermal stresses; Titanium compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2010 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-5430-3
  • Type

    conf

  • DOI
    10.1109/IRPS.2010.5488857
  • Filename
    5488857