DocumentCode

2700166

Title

Adaptlive Solder Paste Composites Smart Solder Pastes

Author

Val, Christian ; Leroy, Michcl ; Boulharts, Habiba

fYear

1993

fDate

9-11 Jun 1993

Firstpage

50

Lastpage

53

Keywords

Copper alloys; Corrosion; Iron alloys; Materials testing; Mechanical factors; Nickel alloys; Silicon alloys; Stress; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639344

Filename

639344