Title :
Adaptlive Solder Paste Composites Smart Solder Pastes
Author :
Val, Christian ; Leroy, Michcl ; Boulharts, Habiba
Keywords :
Copper alloys; Corrosion; Iron alloys; Materials testing; Mechanical factors; Nickel alloys; Silicon alloys; Stress; Temperature; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639344
