DocumentCode
2700173
Title
The time dependent defect spectroscopy (TDDS) for the characterization of the bias temperature instability
Author
Grasser, T. ; Reisinger, H. ; Wagner, P.-J. ; Schanovsky, F. ; Goes, W. ; Kaczer, B.
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2010
fDate
2-6 May 2010
Firstpage
16
Lastpage
25
Abstract
We introduce a new method to analyze the statistical properties of the defects responsible for the ubiquitous recovery behavior following negative bias temperature stress, which we term time dependent defect spectroscopy (TDDS). The TDDS relies on small-area metal-oxide-semiconductor field effect transistors (MOSFETs) where recovery proceeds in discrete steps. Contrary to techniques for the analysis of random telegraph noise (RTN), which only allow to monitor the defect behavior in a rather narrow window, the TDDS can be used to study the capture and emission times of the defects over an extremely wide range. We demonstrate that the recoverable component of NBTI is due to thermally activated hole capture and emission in individual defects with a very wide distribution of time constants, consistent with nonradiative multiphonon theory previously applied to the analysis of RTN. The defects responsible for this process show a number of peculiar features similar to anomalous RTN previously observed in nMOS transistors. A quantitative model is suggested which can explain the bias as well as the temperature dependence of the characteristic time constants. Furthermore, it is shown how the new model naturally explains the various abnormalities observed.
Keywords
MOSFET; semiconductor device reliability; spectroscopy; statistical analysis; MOSFET; bias temperature instability; characteristic time constants; defect behavior monitoring; nMOS transistors; negative bias temperature stress; nonradiative multiphonon theory; quantitative model; random telegraph noise analysis; small-area metal-oxide-semiconductor field effect transistors; statistical property analysis; temperature dependence; thermal activated hole capture; time dependent defect spectroscopy; FETs; MOSFETs; Monitoring; Niobium compounds; Spectroscopy; Stress; Telegraphy; Temperature dependence; Temperature distribution; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-5430-3
Type
conf
DOI
10.1109/IRPS.2010.5488859
Filename
5488859
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