Title :
Assessment of the reliability of the solder joints of the ultra-fine-pitch FCBGA
Author :
Jang, Joong-Soon ; Kim, Kitae ; Yoo, Kihoon ; Kim, Kang-Dong ; Kim, Jong-Min ; Lee, Hyong-Rok ; Lee, Sang-Won
Author_Institution :
Grad. Sch. of Ind. Eng., Ajou Univ., Suwon, South Korea
Abstract :
In this study, reliability assessment of the IMC layer of the ultra-fine-pitch FC-BGA(Flip-Chip Ball Grid Array) is conducted. The samples are prepared to reveal the differences in the adhesion forces of the IMC layer by dissimilarly establishing each plating thickness for surface finish(Ni/Pd/Au). The hardness and thickness of a P-rich Ni layer, which is known as the weakest section in ENPIG surface, are measured using the nano-indentation and TEM analysis. The degree of adhesion of the IMC layer under each experimental condition is evaluated and the metal plate shear test is performed for verification. The results showed significant correlations between the hardness and thickness of the IMC later and the high fraction defectives of the brittle fractures whose IMC layer had low hardness.
Keywords :
ball grid arrays; fine-pitch technology; flip-chip devices; gold alloys; integrated circuit reliability; nickel alloys; palladium alloys; solders; ENPIG surface; Ni-Pd-Au; TEM analysis; flip-chip ball grid array; intermetallic layer; metal plate shear test; nano-indentation; reliability assessment; solder joints reliability; surface finish; ultra-fine-pitch FCBGA; Adhesives; Correlation; Gold; Nickel; Reliability; Soldering; IMC layer; Shear test; brittle frracture; nano-indentation;
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2012 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-0786-4
DOI :
10.1109/ICQR2MSE.2012.6246349