DocumentCode :
2700440
Title :
GaN-on-Si power field effect transistors
Author :
Germain, M. ; Derluyn, J. ; Van Hove, Marleen ; Medjdoub, F. ; Das, Joydeep ; Cheng, S.D.K. ; Leys, M. ; Visalli, D. ; Marcon, Denis ; Geens, K. ; Viaene, J. ; Sijmus, B. ; Decoutere, Stefaan ; Cartuyvels, R. ; Borghs, G.
Author_Institution :
Process Technol., IMEC, Leuven, Belgium
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
171
Lastpage :
172
Abstract :
GaN-on-Si has become the most promising technology for next-generation power switching devices to overcome intrinsic Si limits for high temperature operation, high efficiency at high operating voltage, and high switching frequency. Depletion-mode devices are already offering more than one order of magnitude lower specific on-resistance above 600V. Further, we have recently demonstrated e-mode devices (Vt > 0.5V) with high current density, thanks to a unique in-situ SiN passivation approach. This in-situ SiN layer is further shown to be a key parameter for device stability at elevated temperatures, significantly enhancing the device reliability in high temperature accelerated lifetime tests.
Keywords :
gallium compounds; power field effect transistors; semiconductor device reliability; silicon compounds; wide band gap semiconductors; GaN; SiN; depletion-mode devices; device reliability; device stability; next-generation power switching devices; power field effect transistors; Current density; FETs; Life estimation; Lifetime estimation; Passivation; Silicon compounds; Stability; Switching frequency; Temperature; Voltage; GaN; HEMT; Ill-Nitrides; Si substrate; e-mode; power switching devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-5063-3
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2010.5488899
Filename :
5488899
Link To Document :
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