DocumentCode :
2700672
Title :
Effect of anodic interface layers on the unipolar switching of HfO2-based resistive RAM
Author :
Wang, X.P. ; Chen, Y.Y. ; Pantisano, L. ; Goux, L. ; Jurczak, M. ; Groeseneken, G. ; Wouters, D.J.
Author_Institution :
IMEC vzw, Leuven, Belgium
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
140
Lastpage :
141
Abstract :
In this work, the effect of the anode electrode-HfO2 interface on unipolar switching for HfO2-based RRAM is systematically investigated. It is found that the switching behavior can be improved not only by changing the anode electrode material (TiN vs. Pt), but also by engineering the anodic interface with thin M or MOx capping layers between the electrode and the HfO2 film, such as Ti or TiO. The relative stability of oxide formation, as expressed by the thermodynamic parameter, ΔfG (molar Gibbs energy of oxide formation), is introduced in this work to understand those different switching behaviors more directly.
Keywords :
hafnium compounds; random-access storage; titanium compounds; HfO2; TiN; anode electrode material; anodic interface layers; molar Gibbs energy; oxide formation; relative stability; resistive RAM; resistive random access memory; thermodynamic parameter; unipolar switching; Anodes; Bonding; Degradation; Electrodes; Hafnium oxide; Power engineering and energy; Thermal stability; Thermodynamics; Tin; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-5063-3
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2010.5488914
Filename :
5488914
Link To Document :
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