• DocumentCode
    2700816
  • Title

    Organic semiconductor strain sensors

  • Author

    Jung, Soyoun ; Jackson, Tom

  • Author_Institution
    Dept. of Electr. Eng., Penn. State Univ., University Park, PA
  • Volume
    1
  • fYear
    2005
  • fDate
    22-22 June 2005
  • Firstpage
    149
  • Lastpage
    150
  • Abstract
    In this paper, the authors report the first strain sensors using an organic semiconductor as the active element. The authors have used a doped organic semiconductor as the active element for low Young´s modulus strain sensors. The sensor cross-section is shown. For these sensors 2 nm thick Ti and 20 nm thick Au were deposited on 50 micron thick polyimide substrates by thermal evaporation and patterned to form sensor electrodes and wiring. Next, a 50 nm thick pentacene layer was deposited, again by thermal evaporation. The pentacene layer was then doped p-type by exposure to a 1 % solution of ferric chloride in water. The doped pentacene film was then patterned using an aqueous polyvinyl alcohol photolithography step and oxygen reactive ion etching. The maximum process temperature used to fabricate the organic strain sensors is 110 degC
  • Keywords
    Young´s modulus; evaporation; gold; organic semiconductors; photolithography; semiconductor doping; sputter etching; strain sensors; titanium; 110 C; 2 nm; 20 nm; 50 nm; Au; Ti; Young´s modulus strain sensors; aqueous polyvinyl alcohol; doped pentacene film; ferric chloride; organic semiconductor; organic strain sensors; oxygen reactive ion etching; pentacene layer; photolithography step; polyimide substrates; sensor electrodes; thermal evaporation; Capacitive sensors; Electrodes; Gold; Organic semiconductors; Pentacene; Polyimides; Substrates; Temperature sensors; Thermal sensors; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference Digest, 2005. DRC '05. 63rd
  • Conference_Location
    Santa Barbara, CA
  • Print_ISBN
    0-7803-9040-7
  • Type

    conf

  • DOI
    10.1109/DRC.2005.1553097
  • Filename
    1553097