DocumentCode
2700816
Title
Organic semiconductor strain sensors
Author
Jung, Soyoun ; Jackson, Tom
Author_Institution
Dept. of Electr. Eng., Penn. State Univ., University Park, PA
Volume
1
fYear
2005
fDate
22-22 June 2005
Firstpage
149
Lastpage
150
Abstract
In this paper, the authors report the first strain sensors using an organic semiconductor as the active element. The authors have used a doped organic semiconductor as the active element for low Young´s modulus strain sensors. The sensor cross-section is shown. For these sensors 2 nm thick Ti and 20 nm thick Au were deposited on 50 micron thick polyimide substrates by thermal evaporation and patterned to form sensor electrodes and wiring. Next, a 50 nm thick pentacene layer was deposited, again by thermal evaporation. The pentacene layer was then doped p-type by exposure to a 1 % solution of ferric chloride in water. The doped pentacene film was then patterned using an aqueous polyvinyl alcohol photolithography step and oxygen reactive ion etching. The maximum process temperature used to fabricate the organic strain sensors is 110 degC
Keywords
Young´s modulus; evaporation; gold; organic semiconductors; photolithography; semiconductor doping; sputter etching; strain sensors; titanium; 110 C; 2 nm; 20 nm; 50 nm; Au; Ti; Young´s modulus strain sensors; aqueous polyvinyl alcohol; doped pentacene film; ferric chloride; organic semiconductor; organic strain sensors; oxygen reactive ion etching; pentacene layer; photolithography step; polyimide substrates; sensor electrodes; thermal evaporation; Capacitive sensors; Electrodes; Gold; Organic semiconductors; Pentacene; Polyimides; Substrates; Temperature sensors; Thermal sensors; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 2005. DRC '05. 63rd
Conference_Location
Santa Barbara, CA
Print_ISBN
0-7803-9040-7
Type
conf
DOI
10.1109/DRC.2005.1553097
Filename
1553097
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