• DocumentCode
    2700960
  • Title

    Representation of softness sensation using vibrotactile stimuli under amplitude control

  • Author

    Ben Porquis, Lope ; Konyo, Masashi ; Tadokoro, Satoshi

  • Author_Institution
    Grad. Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
  • fYear
    2011
  • fDate
    9-13 May 2011
  • Firstpage
    1380
  • Lastpage
    1385
  • Abstract
    An experimental study was done to examine the relationship between vibrotactile amplitude displacement and softness sensation. Merkel Disk behavior relative to softness sensation was studied under psychophysical experimentation of human participants. Restrictions are carefully applied on contact area spreading so that vibration will be the only factor that would induce a sensation. A vibrotactile device was excited at constant frequency and its amplitude is adjusted at different levels to alter the amount of skin displacement. Volunteers participated in a two-alternative force choice experiment were ask to compare the perceived softness difference between voice coil and silicone rubber. Statistical analysis on the responses of participants showed a decline of spring constant. It was interesting to note, that even though contact area was significantly restrained participants were still able to discriminate softness sensation form vibrotactile stimulation. Such observation possibly shows that illusion of contact area spread rate can be reproduced by vibrotactile stimulation.
  • Keywords
    displacement control; psychology; statistical analysis; tactile sensors; touch (physiological); Merkel Disk behavior; amplitude control; psychophysical experimentation; silicone rubber; skin displacement; softness sensation representation; spring constant; statistical analysis; vibrotactile amplitude displacement; vibrotactile stimulation; vibrotactile stimuli; voice coil; Coils; Force; Humans; Rubber; Springs; Surgery; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2011 IEEE International Conference on
  • Conference_Location
    Shanghai
  • ISSN
    1050-4729
  • Print_ISBN
    978-1-61284-386-5
  • Type

    conf

  • DOI
    10.1109/ICRA.2011.5980378
  • Filename
    5980378