DocumentCode :
2700961
Title :
Trace Element Effect On Tin-lead (60%-40%) Solder Wetting
Author :
Wu, Nianzu
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
62
Lastpage :
65
Keywords :
Copper; Electronics industry; Gallium alloys; Gallium compounds; Impurities; Ovens; Production facilities; Surface cleaning; Surface treatment; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639348
Filename :
639348
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2700961
