DocumentCode
2700988
Title
3D Integration technology for energy efficient system design
Author
Borkar, Shekhar
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
2010
fDate
26-28 April 2010
Firstpage
100
Lastpage
103
Abstract
CMOS scaling will continue, doubling transistor integration capacity every two years, providing billions of transistors to enable future novel systems. 3D integration technology will open the doors even further, changing the landscape and allowing integration of diverse functionality to realize energy-efficient and affordable complex systems that will continue to deliver higher performance. This paper presents how to exploit this new technology for energy efficient system design.
Keywords
CMOS integrated circuits; transistors; 3D integration technology; CMOS scaling; complex systems; doubling transistor integration capacity; energy efficient system design; CMOS technology; Cost function; Energy efficiency; Frequency; Logic design; Moore´s Law; Random access memory; System-on-a-chip; Through-silicon vias; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
978-1-4244-5063-3
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2010.5488932
Filename
5488932
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