DocumentCode
2701044
Title
Effect of underlayer on sputtered aluminum grain structure and its correlation with step coverage in submicron vias
Author
Pramanik, Dipankar ; Jain, Vivek
Author_Institution
VLSI Technol. Inc., San Jose, CA, USA
fYear
1990
fDate
12-13 Jun 1990
Firstpage
332
Lastpage
334
Abstract
Summary form only given. The grain size and intragrain roughness of aluminum films has been studied for various underlayers under the same deposition conditions. Intragrain roughness is shown to correlate with breaks in Al step coverage on via sidewalls. It is concluded that the best step coverages will be obtained for those underlayers and deposition conditions which produce the minimum intragrain roughness
Keywords
CVD coatings; aluminium; grain size; metallic thin films; metallisation; deposition conditions; grain size; intragrain roughness; step coverage; submicron vias; underlayers; via sidewalls; Aluminum; Artificial intelligence; Grain size; Lead; Rough surfaces; Semiconductor films; Silicon compounds; Surface morphology; Surface roughness; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location
Santa Clara, CA
Type
conf
DOI
10.1109/VMIC.1990.127888
Filename
127888
Link To Document