Title :
Effect of underlayer on sputtered aluminum grain structure and its correlation with step coverage in submicron vias
Author :
Pramanik, Dipankar ; Jain, Vivek
Author_Institution :
VLSI Technol. Inc., San Jose, CA, USA
Abstract :
Summary form only given. The grain size and intragrain roughness of aluminum films has been studied for various underlayers under the same deposition conditions. Intragrain roughness is shown to correlate with breaks in Al step coverage on via sidewalls. It is concluded that the best step coverages will be obtained for those underlayers and deposition conditions which produce the minimum intragrain roughness
Keywords :
CVD coatings; aluminium; grain size; metallic thin films; metallisation; deposition conditions; grain size; intragrain roughness; step coverage; submicron vias; underlayers; via sidewalls; Aluminum; Artificial intelligence; Grain size; Lead; Rough surfaces; Semiconductor films; Silicon compounds; Surface morphology; Surface roughness; Transistors;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location :
Santa Clara, CA
DOI :
10.1109/VMIC.1990.127888
