• DocumentCode
    2701265
  • Title

    Temperature distribution in RTV silicone rubber coating following dry band arcing

  • Author

    Kim, Seog Hyeon ; Hackam, Reuben

  • Author_Institution
    Ford Motor Co., Windsor, Ont., Canada
  • fYear
    1994
  • fDate
    5-8 Jun 1994
  • Firstpage
    599
  • Lastpage
    602
  • Abstract
    The loss of hydrophobicity of room temperature vulcanizing (RTV) silicone rubber coating on insulators, due to dry band arcing in the presence of contamination and moisture, causes a deleterious effect in the electrical performance of the coating. For example the growth of the leakage current is accelerated resulting in more intense discharges which may lead to flashover and an outage in the system. The arcing causes an increase in the temperature of the surface and then in the bulk of the coating which leads to bond scissions and other chemical changes. In the present paper the temperature distribution on the surface and in the bulk of the coating is determined as a function of the arc duration and the size of the arc on the 100 pph (part per hundred) alumina trihydrate (ATH) filled RTV coating. The significance of the temperature rise in the coating on the loss and recovery of hydrophobicity is discussed
  • Keywords
    arcs (electric); heat transfer; insulating coatings; leakage currents; moisture; silicone rubber; silicone rubber insulators; temperature distribution; RTV silicone rubber coating; alumina trihydrate filled RTV coating; arc duration; arc size; bond scissions; contamination; dry band arcing; electrical performance; hydrophobicity loss; insulators; leakage current; moisture; room temperature vulcanized rubber; temperature distribution; temperature rise; Arc discharges; Coatings; Contamination; Dielectrics and electrical insulation; Leakage current; Moisture; Performance loss; Rubber; Surface discharges; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-1942-7
  • Type

    conf

  • DOI
    10.1109/ELINSL.1994.401383
  • Filename
    401383