Title :
Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film
Author :
Takeda, Kazuya ; Uematsu, Yoshio
Keywords :
Aluminum; Circuit testing; Conducting materials; Copper; Curing; Plastic insulation; Polymer films; Printed circuits; Thermal conductivity; Thick films;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639352
