Title :
SPICE temperature modeling for VLSI design using the level-4 model
Author :
Wan, Chung-Ping ; Lee, Ji-Chien ; Sheu, Bing J.
Author_Institution :
Univ. of Southern California, Los Angeles, CA, USA
Abstract :
Complete VLSI (very large scale integration) circuit simulation requires accurate temperature modeling. A modeling methodology using the sensitive parameter subset concept is proposed to provide accurate and efficient prediction of temperature effects for the SPICE level-4 model. A model parameter subset that has large effects on the transistor output characteristics is identified through a sensitivity analysis. Circuit simulation using this approach has shown good agreement with experimental data on device characteristics and the performance of several digital and analog circuits
Keywords :
VLSI; circuit CAD; circuit analysis computing; electronic engineering computing; semiconductor device models; sensitivity analysis; CAD; SPICE temperature modeling; VLSI design; circuit simulation; computer aided technique; level-4 model; model parameter subset; sensitive parameter subset concept; sensitivity analysis; transistor output characteristics; very large scale integration; Analog circuits; Circuit optimization; Circuit simulation; MOSFETs; Predictive models; SPICE; Sensitivity analysis; Temperature dependence; Temperature sensors; Very large scale integration;
Conference_Titel :
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location :
Taipei
DOI :
10.1109/VTSA.1989.68594
