Title :
Develop Of Thick Copper Film Metallized Alumina Substrate for Small Size, High Power, On-Board Power Supply
Author :
Tedoriya, Kauo ; Kanamaru, Akira ; Mohri, Mamoru
Keywords :
Bonding; Circuits; Copper; Lamination; Metallization; Positron emission tomography; Power supplies; Slurries; Substrates; Switching frequency;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639354
