• DocumentCode
    2701687
  • Title

    Design considerations of 3-D single package communicator (SPC) for quad-band WCDMA/GSM cellular phone

  • Author

    Kundu, Arun ; Megahed, Mohamed

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    2010
  • fDate
    Aug. 28 2010-Sept. 3 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A complete single package communicator (SPC) designed and implemented for 3G modem in 400 mm2 size and 1.3 mm height, for the first time is presented. With the help of 3-D technology, development of highly integrated active/passive components and use of latest packaging technology, the design was doable. Optimization of the RF performance of all GSM and WCDAM channels was obtainable despite the small form factor. The design was taped out.
  • Keywords
    cellular radio; code division multiple access; 3D single package communicator; GSM cellular phone; SPC; active-passive component; quad-band WCDMA; Couplings; Modems; Multiaccess communication; Radio frequency; Spread spectrum communication; Substrates; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Information Technology and Systems (ICWITS), 2010 IEEE International Conference on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-7091-4
  • Type

    conf

  • DOI
    10.1109/ICWITS.2010.5611941
  • Filename
    5611941
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2701687