Development of solderless joining technologies using conductive adhesives

Author

Takezawa, H. ; Itagaki, M. ; Mitani, T. ; Bessho, Y. ; Eda, K.

Author_Institution

Matsushita Electr. Ind. Co. Ltd., Japan

fYear

1999

fDate

14-17 Mar 1999

Firstpage

11

Lastpage

15

Abstract

A solderless joining technique using a new Ni-type conductive adhesive was developed. First, the electrical performance was evaluated using a practical module. The delay time and output voltage of a hybrid IC (HIC) module assembled using the conductive adhesive were equivalent to that using standard eutectic solder. Secondly, the joining reliability was examined using an area array package. No electromigration was observed at any joint in the temperature-humidity bias (THB) test (85°C, 85%RH, DC 5 V, 1000 hr). A ceramic chip scale package (CSP-C) mounted on an FR-4 motherboard using this conductive adhesive showed 5 times longer lifetime than that using standard eutectic solder in temperature cycling tests (-40 to 125°C). Additional lifetime extension was attained through change in the packaging structure

Keywords

adhesives; assembling; ceramic packaging; chip scale packaging; conducting polymers; filled polymers; humidity; hybrid integrated circuits; nickel; thermal stresses; -40 to 125 C; 1000 hr; 5 V; 85 C; CSP-C; FR-4 motherboard; Ni; Ni-type conductive adhesive; area array package; ceramic chip scale package; conductive adhesive; conductive adhesive assembly; conductive adhesives; delay time; electrical performance; electromigration; eutectic solder; hybrid IC module; joining reliability; lifetime extension; output voltage; package lifetime; packaging structure; solderless joining technique; solderless joining technologies; temperature cycling tests; temperature-humidity bias test; Assembly; Ceramics; Chip scale packaging; Conductive adhesives; Delay effects; Electromigration; Hybrid integrated circuits; Temperature; Testing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757279

Filename

757279