• DocumentCode
    2701825
  • Title

    Preparation of a new organic/inorganic hybrid film PVDF/SiO2 by sol-gel process

  • Author

    Bai, Wei ; Yang, Daben

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    1994
  • fDate
    5-8 Jun 1994
  • Firstpage
    590
  • Lastpage
    591
  • Abstract
    We have developed a new technology related to the sol-gel process for manufacturing hybrid film PVDF/SiO2. This hybrid film is a new dielectric film, and has remarkable dielectric and flexible features. In our experiment, it is found that the solution viscosity of SiO2 and PVDF is one of the most important factors for forming high quality hybrid film PVDF/SiO2. The experimental results show: hybrid film PVDF/SiO2 is transparent and flexible, its dielectric constant ε=2.81~8.57, and dissipation factor tan δ is less than 1×10-4 at 1 MHz with 1:1 weight fraction of PVDF/SiO2
  • Keywords
    composite insulating materials; dielectric losses; dielectric thin films; filled polymers; insulating coatings; permittivity; polymer films; polymerisation; silicon compounds; sol-gel processing; viscosity; SiO2; dielectric constant; dielectric film; dissipation factor; organic/inorganic hybrid film; sol-gel process; solution viscosity; weight fraction; Dielectric constant; Dielectric films; Dielectric materials; Dielectric measurements; Inorganic materials; Manufacturing processes; Polymers; Silicon compounds; Temperature sensors; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-1942-7
  • Type

    conf

  • DOI
    10.1109/ELINSL.1994.401386
  • Filename
    401386
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2701825