DocumentCode :
2701825
Title :
Preparation of a new organic/inorganic hybrid film PVDF/SiO2 by sol-gel process
Author :
Bai, Wei ; Yang, Daben
Author_Institution :
Dept. of Mater. Sci. & Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
1994
fDate :
5-8 Jun 1994
Firstpage :
590
Lastpage :
591
Abstract :
We have developed a new technology related to the sol-gel process for manufacturing hybrid film PVDF/SiO2. This hybrid film is a new dielectric film, and has remarkable dielectric and flexible features. In our experiment, it is found that the solution viscosity of SiO2 and PVDF is one of the most important factors for forming high quality hybrid film PVDF/SiO2. The experimental results show: hybrid film PVDF/SiO2 is transparent and flexible, its dielectric constant ε=2.81~8.57, and dissipation factor tan δ is less than 1×10-4 at 1 MHz with 1:1 weight fraction of PVDF/SiO2
Keywords :
composite insulating materials; dielectric losses; dielectric thin films; filled polymers; insulating coatings; permittivity; polymer films; polymerisation; silicon compounds; sol-gel processing; viscosity; SiO2; dielectric constant; dielectric film; dissipation factor; organic/inorganic hybrid film; sol-gel process; solution viscosity; weight fraction; Dielectric constant; Dielectric films; Dielectric materials; Dielectric measurements; Inorganic materials; Manufacturing processes; Polymers; Silicon compounds; Temperature sensors; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
Conference_Location :
Pittsburgh, PA
ISSN :
1089-084X
Print_ISBN :
0-7803-1942-7
Type :
conf
DOI :
10.1109/ELINSL.1994.401386
Filename :
401386
Link To Document :
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