Pre-applied underfills for low cost flip chip processing

Author

Johnson, C. Dustin ; Baldwin, Daniel F.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

73

Lastpage

76

Abstract

This paper discusses the development of process technologies and material systems which could make the flip chip assembly process transparent to SMT packaging and assembly lines by eliminating the flip chip flux application, underfill application, and underfill cure processes. This is done by using reflowable encapsulants applied to bumped flip chip wafers. The required material properties for such a system are discussed along with the performance of different underfill materials and application methods, including preliminary yield results

Keywords

assembling; encapsulation; flip-chip devices; integrated circuit packaging; soldering; surface chemistry; surface mount technology; SMT assembly lines; SMT packaging; application methods; bumped flip chip wafers; flip chip assembly process; flip chip flux application; flip chip processing; flip chip processing cost; material properties; material systems; pre-applied underfills; process technologies; reflowable encapsulants; underfill application; underfill cure processes; underfill materials; Assembly systems; Coatings; Costs; Flip chip; Packaging; Shadow mapping; Space technology; Substrates; Surface-mount technology; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757290

Filename

757290