Effect of oxidation on mold compound-copper leadframe adhesion

Author

Berriche, R. ; Vahey, S.C. ; Gillett, B.A.

Author_Institution

Harris Semicond., Melbourne, FL, USA

fYear

1999

fDate

14-17 Mar 1999

Firstpage

77

Lastpage

82

Abstract

The effect of oxidation on adhesion between a mold compound and copper leadframe material was investigated for OCN and DCP molding compounds and one copper alloy. The oxidation temperatures selected were 175 and 200°C and the bake times were varied between 5 minutes and 118 hours. Adhesion strength results obtained by the button shear test method indicated that the DCP mold compound-Cu adhesion was virtually unaffected by oxidation of the Cu at both 175 and 200°C for exposure times up to 50 minutes. The adhesion in the case of the OCN mold compound was lower and exhibited a sharp decrease with increasing bake time at both temperatures. The degradation in adhesion strength was attributed primarily to the low cohesive strength of the copper oxide layer

Keywords

adhesion; copper; encapsulation; heat treatment; integrated circuit packaging; moulding; oxidation; plastic packaging; 175 C; 200 C; 5 min to 118 hr; Cu; Cu oxidation; CuO-Cu; DCP mold compound-Cu adhesion; DCP molding compound; OCN molding compound; adhesion; adhesion strength; bake times; button shear test method; cohesive strength; copper alloy; copper leadframe material; copper oxide layer; mold compound; mold compound-copper leadframe adhesion; oxidation; oxidation temperature; Adhesives; Copper alloys; Degradation; Lead compounds; Oxidation; Packaging; Resins; Semiconductor materials; System testing; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757291

Filename

757291