Title :
Return Loss of Three Types of Arching Bond Wire Structures for RF and Microwave Circuit Applications
Author :
Chen, Hsing-Yi ; Tai, Chen-Hsien
Author_Institution :
Dept. of Commun. Eng., Yuan Ze Univ., Taoyuan
Abstract :
The S-parameters of a gold wire bonded in air to two microstrip lines are validated by measurements and HFSS software simulations at frequencies 0.04~6 GHz. From simulation results and measurement data, it is found that an arching bond wire with smaller arc angle can minimize the return loss. From simulations, it is also found that the return loss can be improved and operation frequency shifts can be achieved by using multiple wires placed in parallel in bond wire arrays
Keywords :
UHF circuits; lead bonding; microstrip lines; microwave circuits; HFSS software simulations; RF circuit applications; S-parameters; arc angle; arching bond wire structures; bond wire arrays; microstrip lines; microwave circuit applications; operation frequency shifts; return loss; Application software; Bonding; Circuit simulation; Frequency measurement; Gold; Microstrip; Microwave circuits; Radio frequency; Scattering parameters; Wire;
Conference_Titel :
Antennas and Propagation Society International Symposium 2006, IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
1-4244-0123-2
DOI :
10.1109/APS.2006.1711349
