Aluminum nitride packaging

Author

Ishida, Masanobu ; Hasegawa, Tomohide ; Iwaida, Toshihiro ; Knudsen, Ame

Author_Institution

R&D Center, Kyocera Corp., Japan

fYear

1999

fDate

14-17 Mar 1999

Firstpage

133

Lastpage

135

Abstract

Due to its high thermal conductivity (TC) and a low thermal expansion coefficient, which is comparable to that of Si, aluminum nitride (AlN) has been adopted for packages requiring high thermal dissipation. Kyocera has been conducting research and development on AlN for more than ten years, and has produced many kinds of AlN products, such as Cer-Quad and multilayer packages, in addition to thin film substrates. We have developed a novel low-temperature co-fireable AlN composition (AN75W) to reduce cost. In this paper, we describe the thermal properties of the AN75W material, with a brief description of the general characteristics of packages produced with this ceramic

Keywords

aluminium compounds; ceramic packaging; cooling; thermal conductivity; thermal expansion; thermal management (packaging); AN75W material; AlN; AlN packages; AlN product; Cer-Quad packages; aluminum nitride; aluminum nitride packaging; ceramic packages; low-temperature co-fireable AlN composition; multilayer packages; package characteristics; thermal conductivity; thermal dissipation; thermal expansion coefficient; thermal properties; thin film substrates; Aluminum nitride; Ceramics; Costs; Nonhomogeneous media; Packaging; Research and development; Substrates; Thermal conductivity; Thermal expansion; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757300

Filename

757300