DocumentCode :
2702366
Title :
What implications will the transfer from desktop to mobile have on materials?
Author :
Savolainen, Petri ; Kulojarvi, Kari
Author_Institution :
Nokia-Japan Co. Ltd., Tokyo, Japan
fYear :
1999
fDate :
14-17 Mar 1999
Firstpage :
214
Lastpage :
217
Abstract :
Expanding utilization of portable electronics, including communication equipment and computers, requires very good packaging efficiency; more functions and higher performance must be incorporated into an ever-smaller housing. New components and substrates must be developed to meet the challenge because higher component density is an inevitable trend. It is extremely important to find low cost components and substrates, with better performance and reliability than that required from their predecessors. Furthermore, interconnection technologies should fulfil the requirements for high-density assembly. A tremendous amount of development work is still needed so that materials coping with increased user needs can be introduced in time for volume production of next generation products
Keywords :
assembling; cellular radio; chip scale packaging; integrated circuit interconnections; integrated circuit reliability; portable computers; technological forecasting; communication equipment; component cost; component density; computers; desktop electronics; functionality; high-density assembly; housing size; interconnection technologies; mobile electronics; package substrates; packaging efficiency; packaging materials; portable electronics; reliability; substrate cost; volume production; Assembly; Chip scale packaging; Components, packaging, and manufacturing technology; Cost function; Electronics packaging; Integrated circuit packaging; Packaging machines; Production; Wafer scale integration; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
Type :
conf
DOI :
10.1109/ISAPM.1999.757314
Filename :
757314
Link To Document :
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