CSP present and future

Chip scale packaging offers an attempt to bridge the manufacturing gulf between what has been done in the past with perimeter leaded wire-bonded packaging and what is and will be done in the future with area array flip chip packaging. In particular, chip scale packaging attempts to produce a package that can be assembled in a manner that is close to conventional. In so doing, it provides an interface to test that is comfortable and familiar. CSPs offer interconnection densities higher than conventional wire-bonding but with reduced space utilization. However, there are still choices to be made within the chip scale family and this discussion indicates an important choice in terms of assembly