ShellCase ultrathin chip size package

Author

Badihi, A.

Author_Institution

ShellCase, Jerusalem

fYear

1999

fDate

14-17 Mar 1999

Firstpage

236

Lastpage

240

Abstract

As the demand for ever-smaller electronic and optical devices grows, manufacturers are seeking ways to reduce IC size and weight. A fully packaged integrated circuit can now be as small and thin as the chip itself. The chip size package (CSP) is fundamentally changing the way electronic products are being designed. The ShellCase CSP, for peripheral, area array and BGA applications and for optical applications, is distinguished by its ultra-thin profile, its reliability, and its cost-effective wafer-level process

Keywords

ball grid arrays; chip scale packaging; integrated circuit design; integrated circuit reliability; integrated circuit testing; integrated optoelectronics; BGA applications; CSP; IC size; IC weight; ShellCase CSP; ShellCase ultrathin chip size package; area array packaging; chip size; chip size package; chip thickness; cost-effective wafer-level process; electronic device size; electronic product design; fully packaged integrated circuit; optical applications; optical device size; peripheral leaded packaging; reliability; ultra-thin profile; Chip scale packaging; Electronics packaging; Integrated circuit packaging; Integrated circuit reliability; Manufacturing; Optical arrays; Optical devices; Photonic integrated circuits; Product design; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757319

Filename

757319