DocumentCode
2702461
Title
Polymer-based board-level optical interconnects
Author
Hashim, A. ; Bamiedakis, N. ; Beals, J., IV ; Hao, Y. ; Penty, R.V. ; White, I.H.
Author_Institution
Dept. of Eng., Univ. of Cambridge, Cambridge, UK
fYear
2011
fDate
17-19 Oct. 2011
Firstpage
1
Lastpage
5
Abstract
This paper provides an overview of the rationale behind the significant interest in polymer-based on-board optical links together with a brief review of recently reported work addressing certain challenges in this field. Polymer-based optical links have garnered considerable research attention due to their important functional attributes and compelling cost-benefit advantages in on-board optoelectronic systems as they can be cost-effectively integrated on conventional printed circuit boards. To date, significant work on the polymer materials, their fabrication process and their integration on standard board substrates have enabled the demonstration of numerous high-speed on-board optical links. However, to be deployed in real-world systems, these optoelectronic printed circuit boards (OE PCBs) must also be cost-effective. Here, recent advances in the integration process focusing on simple direct end-fire coupling schemes and the use of low-cost FR4 PCB substrates are presented. Performance of two proof-of-principle 10 Gb/s systems based on this integration method are summarised while work in realising more complex yet compact planar optical components is outlined.
Keywords
integrated optoelectronics; optical interconnections; polymers; printed circuits; bit rate 10 Gbit/s; compact planar optical components; direct end-fire coupling schemes; fabrication process; low-cost FR4 PCB substrates; on-board optoelectronic systems; optoelectronic printed circuit boards; polymer materials; polymer-based board-level optical interconnects; polymer-based on-board optical links; standard board substrates; Optical coupling; Optical fiber communication; Optical fibers; Optical polymers; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics (ICP), 2011 IEEE 2nd International Conference on
Conference_Location
Kata Kinabalu
Print_ISBN
978-1-61284-265-3
Electronic_ISBN
978-1-61284-263-9
Type
conf
DOI
10.1109/ICP.2011.6106849
Filename
6106849
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