• DocumentCode
    2702626
  • Title

    Electrically isotropic conductive adhesives: an effective contact resistance model for conductivity development

  • Author

    Abdullah, Mikrajuddin ; Shi, Frank G. ; Chungpaiboonpatana, Surasit ; Okuyama, Kikuo ; Davidson, Craig ; Adams, Joseph M.

  • Author_Institution
    Fac. of Eng., Hiroshima Univ., Japan
  • fYear
    1999
  • fDate
    14-17 Mar 1999
  • Firstpage
    282
  • Lastpage
    287
  • Abstract
    A model for determination of the electrical resistivity of isotropic conductive adhesives and insulator/conductor composites in general is introduced by considering the role of contact resistance between conductive adhesive constituents. Conductive behaviour is considered to depend on the creation of conducting contacts between metallic filler particles instead of increasing in the concentration of metal particles. This paper resolves several previously unsolved issues, including the effect of the volume fraction of filler particles and particle size on the development of conductivity; the observed variation in percolation threshold; and the possibility of occurence of two percolation thresholds. In addition, the predicted pressure dependence of conductive behaviour is fully supported by the experimental observations. The model also predicts that the percolation threshold can be reduced by pressure
  • Keywords
    adhesives; conducting polymers; contact resistance; electrical conductivity; electrical resistivity; filled polymers; particle size; percolation; conducting contacts; conductive adhesive constituents; conductive behaviour; conductivity; conductivity development; contact resistance; effective contact resistance model; electrical resistivity; electrically isotropic conductive adhesives; filler particle size; filler particle volume fraction; insulator/conductor composites; isotropic conductive adhesives; metal particle concentration; metallic filler particles; model; percolation threshold; pressure dependence; Conducting materials; Conductive adhesives; Conductivity; Conductors; Contact resistance; Dielectrics and electrical insulation; Electric resistance; Microelectronics; Predictive models; Resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-56-4
  • Type

    conf

  • DOI
    10.1109/ISAPM.1999.757327
  • Filename
    757327