DocumentCode :
2702955
Title :
Hardware-in-the-loop simulation system of multi-path effect of microwave landing system based on scale mode
Author :
Miao Qiang ; Wu De-wei
Author_Institution :
Telecommun. Eng. Inst., AFEU, Xi´an, China
fYear :
2009
fDate :
27-29 Oct. 2009
Firstpage :
543
Lastpage :
548
Abstract :
In this hardware-in-the-loop simulation system, according to the technology system and navigation principle of the microwave landing system (MLS), and according to the characteristics of the laser beam, we use the controllable laser transmitting equipment to simulate the function of the angle navigation antenna of the MLS, radiating well directional laser scanning signal. According to the electromagnetic similitude theory, we set up the scale model of the environment of an airport equipped with MLS, and use the propagation of the laser in the scale model of the airport to simulate the real multi-path effect of the navigation signal transmitted by the MLS. The feasibility of this simulation system is analyzed thoroughly, including the wavelength of laser used and the scanning speed. This simulation system utilizes the MATLAB/RTW rapid prototyping target-xPC target to run the real-time simulation of the airborne receiver signal processing.
Keywords :
microwave landing systems; optical receivers; optical signal detection; radionavigation; airborne receiver signal processing; angle navigation antenna; controllable laser transmitting equipment; directional laser scanning signal; electromagnetic similitude theory; hardware-in-the-loop simulation system; laser beam; microwave landing system; multi-path effect; navigation principle; real-time simulation; technology system; Airports; Electromagnetic modeling; Laser modes; Laser theory; Masers; Mathematical model; Microwave devices; Microwave technology; Multilevel systems; Navigation; MLS; hardware-in-the-loop; multi-path effect; scale model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4076-4
Type :
conf
DOI :
10.1109/MAPE.2009.5355596
Filename :
5355596
Link To Document :
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