Title :
ASIC/MCM and microcircuit testing using commercial practices
Author :
Miller, Micheal ; Myers, Mark
Author_Institution :
Wright Lab. Manuf. Technol. Directorate, USA
Abstract :
Plastic Encapsulated Microelectronics (PEMs) components are used increasing numbers in military applications. Influencing factors are improving reliability, greater availability and Federal initiatives for use. This discussion focuses on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis is on reliability testing of these components. Reliability testing of PEM\´s for military applications has been somewhat limited in “high-end” devices and packages. This discussion focuses on testing of a wide range of die sizes including large die (⩾0.5" per side), and a wide range of packages, including large packages (up to 2"×2" per side) for both custom and off-the-shelf commercial packages
Keywords :
application specific integrated circuits; electronic equipment testing; encapsulation; integrated circuit packaging; integrated circuit testing; military equipment; multichip modules; plastic packaging; reliability; 0.5 in; 2 in; ASIC; MCM testing; Plastic Encapsulated Microelectronics; availability; custom packages; design verification; die sizes; integrated military product; microcircuit testing; military applications; moisture; off-the-shelf commercial packages; plastic encapsulated microcircuits; reliability; reliability testing; Aerospace electronics; Application specific integrated circuits; Availability; Costs; Electronics packaging; Manufacturing; Military aircraft; Plastic packaging; Process design; Testing;
Conference_Titel :
Aerospace and Electronics Conference, 1996. NAECON 1996., Proceedings of the IEEE 1996 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-3306-3
DOI :
10.1109/NAECON.1996.517755
