Abstract :
The following topics are dealt with: test quality and diagnosis; boundary scan testing; delay test and power aware test; frequency behavior of a device; RF testing; embedded memory test and repair; microprocessor supply noise and input/output test; advances in test compression; limited access in-circuit board test; timing jitters; ADCS/mixed signal devices; automatic test equipment; automatic test pattern generation; X-handling for MISR signature; post-silicon test, debug, and validation; performance testing; adaptive testing; yield testing; 3D integrated circuit testing; circuit reliability; and analog testing and design for testability.
Keywords :
automatic test equipment; automatic test pattern generation; boundary scan testing; design for testability; embedded systems; integrated circuit reliability; integrated circuit testing; integrated circuit yield; jitter; mixed analogue-digital integrated circuits; printed circuit testing; 3D integrated circuit testing; ADCS/mixed signal device; MISR signature X-handling; RF testing; adaptive testing; analog testing; automatic test equipment; automatic test pattern generation; boundary scan testing; circuit reliability; delay test; design for testability; device frequency behavior; embedded memory test; in-circuit board test; input/output test; microprocessor supply noise; performance testing; post-silicon test; power aware test; test compression; test quality; timing jitters; yield testing;
Conference_Titel :
Test Conference, 2009. ITC 2009. International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4868-5
DOI :
10.1109/TEST.2009.5355617
