Laser diode array packaging for coupling to optical polyimide waveguides in optoelectronic multichip modules

Author

Koike, Shinji ; Matsui, Shinsuke ; Takahara, Hideyuki

Author_Institution

NTT Interdisciplinary Res. Labs., Japan

fYear

1995

fDate

21-24 May 1995

Firstpage

766

Lastpage

769

Abstract

Opto-electronic multichip modules (OE-MCMs) using organic optical waveguides formed on copper-polyimide multilayer substrates are a promising packaging technology for future photonic switching systems. A laser diode (LD) array packaging technique for coupling to polyimide waveguides on the OE-substrate was developed, in which junction-up, 5-channel InGaAsP edge-emitting LD array (λ=1.3 μm) was positioned on the terrace with passive alignment in the vertical direction, then butt-coupled to the waveguides on the OE-substrate. Optical interconnections between the 5-ch LD array and the waveguides were achieved with the coupling loss of 6.5 dB and deviation between channels of ±0.5 dB

Keywords

III-V semiconductors; gallium arsenide; indium compounds; integrated optoelectronics; multichip modules; optical couplers; optical interconnections; optical losses; photonic switching systems; polymer films; semiconductor device packaging; semiconductor laser arrays; 1.3 micrometre; 6.5 dB; InGaAsP; OE-MCMs; butt-coupling; channel deviation; coupling loss; edge-emitting LD array; laser diode array; optical coupling; optical interconnections; optical polyimide waveguide; optoelectronic multichip modules; packaging; packaging technology; passive alignment; photonic switching systems; Diode lasers; Multichip modules; Nonhomogeneous media; Optical arrays; Optical coupling; Optical waveguides; Packaging; Polyimides; Semiconductor laser arrays; Waveguide junctions;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.517772

Filename

517772