Title :
Packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic modules
Author :
Kalonji, W. ; Semo, J. ; Tannion, J. ; Foucher, M.
Author_Institution :
Lab. de Bagneux, CNET, Bagneux, France
Abstract :
The authors describe a packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic (OE) modules. They use a special OE component-to-singlemode fiber (SMF) coupling arrangement showing up 92% coupling efficiency. In order to attach the fiber to the device and to insure the stability of the alignment, YAG laser welding technique is used. This yields to packaging excess losses ranging from 0.3 to 1 dB. Furthermore, a special device holder has been developed to allow very high speed devices, easy and effective link between several devices
Keywords :
integrated optoelectronics; laser beam welding; optical fibre couplers; optical fibre losses; packaging; 0.3 to 1 dB; 92 percent; alignment stability; component-to-singlemode fiber coupling; coupling efficiency; device holder; excess losses; laser welding technique; optical coupling; packaging technology; pigtailed integrated optoelectronic modules; Bandwidth; High speed optical techniques; Optical coupling; Optical devices; Optical fiber devices; Optical filters; Optical modulation; Packaging; Repeaters; Welding;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517774
