Title :
Failure mechanism of hole formation in laser welding technique for optoelectronic packaging
Author :
Cheng, W.H. ; Wang, W.H. ; Huang, Y.M. ; Chen, H.Y. ; Lin, H.H.
Author_Institution :
Inst. of Electro.-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
The characteristics of hole formation in the laser welding technique for optoelectronic packaging have been investigated by metallographic microscopes. The results show that the hole dimension depends on the power density of the laser beam and the hole disappears as the power density falls below 4×105 W/cm2. The hole generation between welded sections can cause spatial nonuniformity of solidification-shrinkage during the laser welding process, resulting in the generation of micromovement. Micromovement due to the failure mechanism of the hole formation during the laser welding process may affect the alignment for optoelectronic packages, particularly for single-mode fiber applications. Based on our understanding of laser welding process characteristics, a reliability study of receptacle laser packages is currently under investigation
Keywords :
failure analysis; laser beam welding; microscopy; optoelectronic devices; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; alignment; failure mechanism; hole formation; laser beam power density; laser welding technique; metallographic microscopes; micromovement; optoelectronic packaging; receptacle laser packages; reliability study; single-mode fiber applications; solidification-shrinkage; spatial nonuniformity; Costs; Failure analysis; Fiber lasers; Laser beams; Optical fibers; Power lasers; Semiconductor device packaging; Semiconductor lasers; Solid lasers; Welding;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517798
